Sierra Circuits, Inc.
Leader in Quick-Turn HDI PCBs
Capabilities in HDI PCB technology
- Via-in-Pad
- Stacked Microvias
- Staggered Microvias
- Fine pitch down to .25 mm
- Tightly controlled etching capability
- Precise layer to layer registration
- Sequential lamination
- Up to 10 build-up layers
Sierra Circuits HDI Capabilities & Design Rules
Product Features Standard Advanced
Board Types |
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| Rigid PCB | Yes | ||
| Flex and RigidFlex | Yes | ||
| HDI | Sequential Lam | 2 or less lam cycles | > 3 lam cycles |
| Buried Vias | 2 or less | > 3 | |
| Blind Vias | Yes | ||
| Stacked vias | Yes | ||
| Filled Vias | Conductive | Yes | |
| Non Conductive | Yes | ||
| Copper Plate Shut Micro Vias | Yes | ||
| Heat sinks | Yes | ||
| UL | 94V-0 on selected materials. | Yes | |
Quality Reports |
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| Specifications | IPC-6012, Class 1, 2, 3, & 3A | Yes | |
| IPC-6013, Class 1, 2 & 3 | Yes | ||
| MIL-PRF-55110 on selected materials. | Yes | ||
| Reports / Certificates | Micro section | Yes | |
| Solderability | Yes | ||
| X-ray Fluorescence | Yes | ||
| Ionic Contamination | Yes | ||
| Time Domain Reflectometry (TDR) | Yes | ||
| First Article Inspection (FAI) | Yes | ||
| Certificate of Compliance (C of C) | Yes | ||
| Electrical Test | Yes | ||
Construction |
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| Panel Size | Available Panel Sizes | 12" x 18", 18" x 24" | 14" x 26", 21 x 25", 21" x 29" |
| Thickness | Min Board Thickness | .010" | .004" |
| Max Board Thickness | .200" | .200" + | |
| Thickness Tolerance | 10% | < 10% | |
| Bow & Twist Tolerance | 7% | <7% | |
| Layers | Max Layer Count | 24 | 26+ |
| Dielectric | Minimum Core Thickness | .002" | < .002" |
| Minimum Dielectric | .002" | .001" | |
| Foil | Starting Copper Foil Weight | 1/2 oz, 9 micron | 1 micron |
Preferred Materials (refer to attached document for complete approved materials) |
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| FR-4 Lead Free | Isola 370 HR | Yes | |
| Nan Ya NP-175F | Yes | ||
| Nan Ya UV BLOCK FR-4-86 | Yes | ||
| Nan Ya NPG-170 | Yes | ||
| Nelco N4000-13SI | Yes | ||
| Polyimide | Isola P95 | Yes | |
| Nelco N7000-2 VO | Yes | ||
| Teflon | Nelco N9000-13 RF | Yes | |
| Rogers RO3000 Series | Yes | ||
| Rogers RT/DUROID Series | Yes | ||
| Rogers ULTRALAM 2000 | Yes | ||
| Ceramic | Rogers RO4003 | Yes | |
| Rogers RO4230 | Yes | ||
| Rogers RO4350 F | Yes | ||
| Rogers RO4350 | Yes | ||
| Rogers TTM 3, 4, 6, 10, 10i | Yes | ||
| Taconics CER-10 | Yes | ||
| Taconics RF-35A2 | Yes | ||
| Taconics RF-60 | Yes | ||
| Cyanate Ester | Nelco N8000 | Yes | |
| Bond Sheet | Hitachi 671N | Yes | |
| Rogers RO4450B, RO4450F | Yes | ||
| Flex | DuPont Pyralux APÂ | Yes | |
| DuPont Pyralux LFÂ | Yes | ||
| DuPont Pyralux FR | Yes | ||
| Resistor | Rogers RO4003 / 4350 TICER TCR | Yes | |
| Thermal | Thermagon 88 | Yes | |
| Laird IMPCB | Yes | ||
Drill |
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| Laser | Smallest / Largest Laser Drill Diameter | .004" / .008" | .003" / .010 |
| Maximum Aspect Ratio | .75:1 | >.75:1 | |
| Mechanical | Minimum Diameter | .0059" | .004" |
| Maximum Aspect Ratio | Â 10:1 | Â > 10:1 | |
| Minimum Drill to Copper | 0.007 | 0.005 | |
| Tolerance | Minimum Plated Thru Holes | Â +/-.002 | |
| Minimum Non Plated True Holes | Â +/-.001 | ||
Pad Diameter |
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| Outer Layer | Rigid | Drill + .008" + (AR * 2) |
Drill + .006" + (AR * 2) |
| Flex | Drill + .010" + (AR * 2) |
Drill + .008" + (AR * 2) |
|
| Inner Layers | Rigid | Drill + .010" + (AR * 2) |
Drill + .008" + (AR * 2) |
| Flex | Drill + .012" + (AR * 2) |
Drill + .010" + (AR * 2) |
|
Conductors |
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| Pad Sizes | Minimum Pad Size for Electrical Test | 0.0050" | 0.0030" |
| Minimum wire bond pad size | 0.0060" | 0.0040" | |
| Minimum Trace vs. Copper Thickness | 0.00020"Â Â (5 micron) | 0.0025" | 0.0020" |
| Note: Thickness includes starting foilplus panel plates (for wrap if any) to beetched. | 0.00035" (9 micron / 1/4 oz) | 0.0030" | 0.0025" |
| 0.00053" (3/8 oz) | 0.0035" | 0.0030" | |
| 0.0007" (1/2 oz) | 0.0040" | 0.0035" | |
| 0.0014" (1 oz) | 0.0050" | 0.0045" | |
| 0.0028" (2 oz) | 0.0065" | 0.0060" | |
| 0.0042" (3 oz) | 0.0070" | 0.0065" | |
| > 3 oz | Contact Sierra | ||
| Minimum Space vs. Copper Thickness | 0.00020" (5 micron) | 0.0025" | < 0.0025" |
| Note: Thickness includes starting foilplus panel plates (for wrap if any) to beetched. | 0.00035" (9 micron / 1/4 oz) | 0.0030" | < 0.0030" |
| 0.00053" (3/8 oz) | 0.0035" | < 0.0035" | |
| 0.0007" (1/2 oz) | 0.0040" | < 0.0040" | |
| 0.0014" (1 oz) | 0.0050" | < 0.0050" | |
| 0.0028" (2 oz) | 0.0065" | < 0.0065" | |
| 0.0042" (3 oz) | 0.0070" | < 0.0070" | |
| > 3 oz | Contact Sierra | ||
Permanent Solder Mask |
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| Liquid Photoimageable (LPI) | Color | Green, Red, Blue, Yellow | |
| Gloss | Semi - Gloss Matte (Only in Green) |
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| Minimum Dam/Web Size SMT | 0.0040 | ||
| Minimum Dam/Web Size BGA | 0.0035 | ||
| Clearance | =/> 0.0015 | ||
| Mask-Defined SMT or BGA (not Ground Plane) | No | ||
| Mask-Defined Features on Ground Plane | Yes | ||
| Laser Direct Imaging (LDI) | Color | Green Only | |
| Gloss | Semi - Gloss | ||
| Minimum Web for SMT | 0.0035 | ||
| Minimum Web for BGA | 0.0030 | ||
| Clearance | 0 - 0.0014 | ||
| Mask-Defined SMT or BGA (not Ground Plane) | Yes | ||
Legend |
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| Printar | Color | White | |
| Minimum Line/Height | .005/.025" | ||
| Screen Printable | Color | White, Yellow, Black, Red |
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| Minimum Line/Height | 0.007/0.030" | ||
Other Screenable Material |
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| Carbon Ink | Yes | ||
| Peelable Solder Mask | Yes | ||
Surface Finishes |
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| Types | HASL (Vertical & Horizontal) | Yes | |
| Lead Free HASL | Yes | ||
| OSP (Shikoku F2 & Entek) | Yes | ||
| ENIG (Electroless Nickel/Immersion Gold) | Yes | ||
| ENEPIG (Electroless Nickel-Electroless Paladium-Immersion Gold) |
Yes | ||
| Immersion Silver | Yes | ||
| Tin Nickel | Yes | ||
| Electrolytic Soft Gold | Yes | ||
| Electrolytic Hard Gold | Yes | ||
Fabrication |
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| Mechanical | Minimum Route Cutter Available | .024" | .021" |
| Routed Part Size Tolerance | .010" | <.010" | |
| Countersink | Yes | ||
| Counter bore | Yes | ||
| Bevel Angles | 20, 30, 45 | ||
| Laser | Milling, Depth Tolerance | Â +/-.003 | |
| Laser Routed Thickness | <.032" thick | <.032" thick | |
| Routed Array | Yes | ||
| V Score | V Score Angles | 30, 45, 60 | |
| V Score, edge-to-copper | 0.01 | 0.007 | |
| Dicing | Dicing, edge-to-copper | 0.005 | |
| Edge/Castellation | Edge Castellation, Minimum Drill Dia | 0.020" | |
| Edge Plating | Yes | ||
Electrical Test |
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| Controlled Impedance | Tolerance | 10% | 5% |
| Hi Pot | Yes | ||
| Test Voltage | 40 | 250, 500 | |
| Isolation Resistance (Mohms) | 100 | >100 | |
| Continuity Resistance (Ohms) | 10 | <10 | |
| Minimum Pad Size | 0.005 | 0.003 | |
Customer Testimonial
-
Please convey to all the Sierra Circuits team our thanks for a job well done. We received the boards as promised and they are now in use in our
production test areas.
Earl B.
Project Administrator,
Siemens Medical Solutions -
Sierra Circuits has been consistent with great level of service, product quality, timely delivery of PCBs, and timely responses to all questions.
Jose C.
Engineer, Apple, Inc.
Cupertino, CA -
Just got the boards in my office. They look great! To you and your team a hearty thank you!
Ryan S.
Electronics Group,
Battelle Science & Technology International -
I have found Sierra Circuits to be EXTREMELY supportive in resolving any issues in our PCB/Assembly. I feel they have consistently met me more than half way, which makes my job easier.
Paul M
PerkinElmer
Miamisburg, OH -
Thank you very much for the great job with my previous order! Everything was built right on time and quality was good!
Michael K.
Principal Engineer
Telegent Systems, Sunnyvale, CA 94085 -
Thanks for all of your help. You have great engineers. They were on phone with me constantly until I fixed all design/manufacturability issues. I really do appreciate the service.
Zubin L.
NXP Semiconductors (formerly, Phillips Electronics)
San Jose, CA -
Thanks for the great work on the boards! Your company is at the top of my list for future work.
Matt L.
Lexmark